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Freescale Semiconductor Technical Data
MPX2053 Rev 6, 06/2007
50 kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors
The MPX2053/MPXV2053G device is a silicon piezoresistive pressure sensor providing a highly accurate and linear voltage output - directly proportional to the applied pressure. The sensor is a single, monolithic silicon diaphragm with the strain gauge and a thin-film resistor network integrated on-chip. The chip is laser trimmed for precise span and offset calibration and temperature compensation. Features * Temperature Compensated Over 0C to +85C * Easy-to-Use Chip Carrier Package Options * Ratiometric to Supply Voltage * Differential and Gauge Options Application Examples * Pump/Motor Controllers * Robotics * Level Indicators * Medical Diagnostics * Pressure Switching * Non-Invasive Blood Pressure Measurement ORDERING INFORMATION
Device Case MPX Series Options Type No. Order No. SMALL OUTLINE PACKAGE (MPXV2053G SERIES) Ported Gauge, Side 1369 MPXV2053GP Elements Port, SMT Differential 1351 MPXV2053DP Dual Port, SMT UNIBODY PACKAGE (MPX2053 SERIES) Basic Differential 344 MPX2053D Element Ported Differential, 344C MPX2053DP Elements Dual Port Gauge 344B MPX2053GP Gauge, Axial PC Mount Gauge, Vacuum 344F 344D MPX2053GSX MPX2053GVP Packing Options Trays Trays Device Marking MPXV2053G MPXV2053G
MPX2053 MPXV2053G SERIES
0 TO 50 kPA (0 TO 7.25 psi) 40 mV FULL SCALE SPAN (TYPICAL)
SMALL OUTLINE PACKAGES
MPXV2053GP CASE 1369-01
MPXV2053DP CASE 1351-01
SMALL OUTLINE PACKAGE PIN NUMBERS
1 2 3 4 GND(1) +VOUT VS -VOUT 5 6 7 8 N/C N/C N/C N/C
-- -- -- -- --
MPX2053D MPX2053DP MPX2053GP MPX2053D MPX2053GVP
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGE PIN NUMBERS
1 2 GND(1) +VOUT 3 4 VS -VOUT
1. Pin 1 in noted by the notch in the lead.
UNIBODY PACKAGES
MPX2053GP CASE 344-15
MPX2053GP CASE 344B-01
MPX2053DP CASE 344C-01
MPX2053GVP CASE 344D-01
MPX2053GSX CASE 344F-01
(c) Freescale Semiconductor, Inc., 2005-2007. All rights reserved.
VS 3 Thin Film Temperature Compensation and Calibration Circuitry 1 GND
2 4
Sensing Element
+VOUT -VOUT
Figure 1. Temperature Compensated and Calibrated Pressure Sensor Schematic
VOLTAGE OUTPUT VERSUS APPLIED DIFFERENTIAL PRESSURE
The output voltage of the differential or gauge sensor increases with increasing pressure applied to the pressure side (P1) relative to the vacuum side (P2). Similarly, output voltage increases as increasing vacuum is applied to the vacuum side (P2) relative to the pressure side (P1). Figure 1 shows a block diagram of the internal circuitry on the stand-alone pressure sensor chip.
Table 1. Maximum Ratings(1)
Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 200 -40 to +125 -40 to +125 Unit kPa C C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
MPX2053 2 Sensors Freescale Semiconductor
Table 2. Operating Characteristics (VS = 10 VDC, TA = 25C unless otherwise noted, P1 > P2)
Characteristic Pressure Range(1) Supply Voltage(2) Symbol POP VS IO VFSS VOFF V/ -- (0 to 50 kPa) -- -- TCVFSS TCVOFF ZIN ZOUT (10% to 90%) tR -- -- Min 0 -- -- 38.5 -1.0 -- -0.6 -- -- -2.0 -1.0 1000 1400 -- -- -- Typ -- 10 6.0 40 -- 0.8 -- 0.1 0.5 -- -- -- -- 1.0 2.0 0.5 Max 50 16 -- 41.5 1.0 -- 0.4 -- -- 2.0 1.0 2550 3000 -- -- -- Units kPa VDC mAdc mV mV mV/kPa %VFSS %VFSS %VFSS %VFSS mV ms ms %VFSS
Supply Current Full Scale Offset(4) Sensitivity Linearity(5) Pressure Hysteresis(5) Span(3)
Temperature Hysteresis(5) (-40C to +125C) Temperature Effect on Full Scale Temperature Effect on Offset(5) Input Impedance Output Impedance Response Time(6) Span(5)
Warm-Up Time Offset Stability
(7)
1. 1.0 kPa (kiloPascal) equals 0.145 psi. 2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional error due to device self-heating. 3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum related pressure. 4. Offset (VOFF) is defined as the output voltage at the minimum rated pressure. 5. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * TcSpan: Output deviation over the temperature range of 0 to 85C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 6. Response Time is defined as the time form the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPX2053 Sensors Freescale Semiconductor 3
ON-CHIP TEMPERATURE COMPENSATION AND CALIBRATION
kPa PSI
40 35 30 25 20 15 10 5 0 -5
Output (mVdc)
VS = 10 Vdc TA = 25C MPX2053 P1 > P2 MAX
TYP Span Range (Typical) MIN
0
12.5 1.8
25 3.6
37.5 5.4
50 7.25
Offset (Typical)
Figure 2. Output vs. Pressure Differential Figure 2 shows the output characteristics of the MPX2053/ MPXV2053G series at 25C. The output is directly proportional to the differential pressure and is essentially a straight line. The effects of temperature on full scale span and offset are very small and are shown under Operating Characteristics.
Silicone Die Coat Wire Bond
Die P1
Stainless Steel Metal Cover Epoxy Case
Lead Frame P2
RTV Die Bond
Figure 3. Unibody Package: Cross Sectional Diagram (Not to Scale) Figure 3 illustrates the differential/gauge die in the basic chip carrier (Case 344). A silicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPX2053/MPXV2053G series pressure sensor operating characteristics and internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long term reliability. Contact the factory for information regarding media compatibility in your application. LINEARITY Linearity refers to how well a transducer's output follows the equation: Vout = Voff + sensitivity x P over the operating pressure range. There are two basic methods for calculating nonlinearity: (1) end point straight line fit (see Figure 4) or (2) a least squares best line fit. While a least squares fit gives the "best case" linearity error (lower numerical value), the calculations required are burdensome. Conversely, an end point fit will give the "worst case" error (often more desirable in error budget calculations) and the calculations are more straightforward for the user. Freescale's specified pressure sensor linearities are based on the end point straight line method measured at the midrange pressure. MPX2053 4 Sensors Freescale Semiconductor
Least Squares Fit Exaggerated Performance Curve
Least Square Deviation Straight Line Deviation
Relative Voltage Output
End Point Straight Line Fit
Offset 0 50 Pressure (% Full Scale) 100
Figure 4. Linearity Specification Comparison
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing silicone gel which isolates the die from the environment. The Freescale MPX pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the following table.
Table 3. Pressure (P1) Side Delineation
Part Number MPX2053D MPX2053DP MPX2053GP MPX2053GSX MPXV2053GVP MPXV2053GP MPXV2053DP Case Type 344 344C 344B 344F 344D 1369 1351 Pressure (P1) Side Identifier Stainless Steep Cap Side with Part Marking Side with Port Attached Side with Port Attached Stainless Steep Cap Side with Port Attached Side with Part Marking
MPX2053 Sensors Freescale Semiconductor 5
PACKAGE DIMENSIONS
C R M
1
B
-AN
PIN 1
1234
2
3
4
Z
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION -A- IS INCLUSIVE OF THE MOLD STOP RING. MOLD STOP RING NOT TO EXCEED 16.00 (0.630).
DIM A B C D F G J L M N R Y Z INCHES MILLIMETERS MIN MAX MIN MAX 0.595 0.630 15.11 16.00 0.514 0.534 13.06 13.56 0.200 0.220 5.08 5.59 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.40 0.695 0.725 17.65 18.42 30 NOM 30 NOM 0.475 0.495 12.07 12.57 0.430 0.450 10.92 11.43 0.048 0.052 1.22 1.32 0.106 0.118 2.68 3.00
L
-TJ
SEATING PLANE
G F
M
F Y
D 4 PL 0.136 (0.005)
TA
M
DAMBAR TRIM ZONE: THIS IS INCLUDED WITHIN DIM. "F" 8 PL
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
STYLE 2: PIN 1. 2. 3. 4.
VCC - SUPPLY + SUPPLY GROUND
STYLE 3: PIN 1. 2. 3. 4.
GND -VOUT VS +VOUT
CASE 344-15 ISSUE AA UNIBODY PACKAGE
SEATING PLANE
-TR H N
PORT #1 POSITIVE PRESSURE (P1)
-AU L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC
-Q-
B
12 34
PIN 1
K
S
-P0.25 (0.010) J C
M
TQ
S
F G D 4 PL 0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. GROUND 2. + OUTPUT 3. + SUPPLY 4. - OUTPUT
CASE 344B-01 ISSUE B UNIBODY PACKAGE
MPX2053 6 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
V R
PORT #2 PORT #1
-AU W H N
PORT #2 VACUUM (P2)
L
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U V W INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.405 0.435 10.29 11.05 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.159 3.89 4.04 0.063 0.083 1.60 2.11 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC 0.248 0.278 6.30 7.06 0.310 0.330 7.87 8.38
PORT #1 POSITIVE PRESSURE (P1)
-QSEATING PLANE
B
SEATING PLANE
PIN 1
1234
-P-TJ C -T0.25 (0.010)
M
K S
TQ
S
F G D 4 PL
0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344C-01 ISSUE B UNIBODY PACKAGE
-AU -TR N -QSEATING PLANE PORT #2 VACUUM (P2)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D F G H J K L N P Q R S U INCHES MILLIMETERS MIN MAX MIN MAX 1.145 1.175 29.08 29.85 0.685 0.715 17.40 18.16 0.305 0.325 7.75 8.26 0.016 0.020 0.41 0.51 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.182 0.194 4.62 4.93 0.014 0.016 0.36 0.41 0.695 0.725 17.65 18.42 0.290 0.300 7.37 7.62 0.420 0.440 10.67 11.18 0.153 0.159 3.89 4.04 0.153 0.158 3.89 4.04 0.230 0.250 5.84 6.35 0.220 0.240 5.59 6.10 0.910 BSC 23.11 BSC
L H
POSITIVE PRESSURE (P1)
B
12 34
K S
PIN 1
C J
-P0.25 (0.010)
M
F TQ
S
G D
4 PL
0.13 (0.005)
M
TS
S
Q
S
STYLE 1: PIN 1. 2. 3. 4.
GROUND + OUTPUT + SUPPLY - OUTPUT
CASE 344D-01 ISSUE B UNIBODY PACKAGE
MPX2053 Sensors Freescale Semiconductor 7
PACKAGE DIMENSIONS
-TC E A U -QNOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH.
DIM A B C D E F G J K N P Q R S U V INCHES MILLIMETERS MIN MAX MIN MAX 1.080 1.120 27.43 28.45 0.740 0.760 18.80 19.30 0.630 0.650 16.00 16.51 0.016 0.020 0.41 0.51 0.160 0.180 4.06 4.57 0.048 0.064 1.22 1.63 0.100 BSC 2.54 BSC 0.014 0.016 0.36 0.41 0.220 0.240 5.59 6.10 0.070 0.080 1.78 2.03 0.150 0.160 3.81 4.06 0.150 0.160 3.81 4.06 0.440 0.460 11.18 11.68 0.695 0.725 17.65 18.42 0.840 0.860 21.34 21.84 0.182 0.194 4.62 4.92
V
N R
PORT #1 POSITIVE PRESSURE (P1)
B
-P0.25 (0.010)
M
PIN 1
TQ
M
4
3
2
1
S K
J
F D 4 PL 0.13 (0.005)
G
STYLE 1: PIN 1. 2. 3. 4. GROUND V (+) OUT V SUPPLY V (-) OUT
M
TP
S
Q
S
CASE 344F-01 ISSUE B UNIBODY PACKAGE
MPX2053 8 Sensors Freescale Semiconductor
PACKAGE DIMENSIONS
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CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
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CASE 1351-01 ISSUE A SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
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CASE 1369-01 ISSUE B SMALL OUTLINE PACKAGE
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PACKAGE DIMENSIONS
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MPX2053 12 Sensors Freescale Semiconductor
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MPX2053 Rev. 6 06/2007

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